发明名称 ELECTROLESS NICKEL PLATING BATH, AND PLATING METHOD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a plating bath which is friendly to human bodies and the environment because no heavy metal ions of Pb, Bi, Tl, Cd or the like are not contained, and practically usable as an electroless nickel plating bath. SOLUTION: The electroless nickel plating bath contains a water-soluble nickel salt, organic acid or its salt, hypophosphite or boron compound, and acetylenic compound, and contains no metallic ions of Pb, Bi, Tl or Cd, and further the plating bath has any of following features (1) to (3), (1) the plating bath further contains sulfur-based compound, (2) the plating bath contains the organic acids or its salts which are (A) amino acid or its salt and hydroxy carboxylic acid or its salt, or (B) hydroxy monocarboxylic acid or its salt and hydroxy polycarboxylic acid or its salt, and (3) the plating bath contains phosphorous acid or its salt. The plating method using the plating bath is also provided. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005126734(A) 申请公布日期 2005.05.19
申请号 JP20030360248 申请日期 2003.10.21
申请人 C UYEMURA & CO LTD 发明人 SATO MAKOTO;TADA MASANORI;YOSHIDA JUNJI;IWAMIYA YOKO
分类号 C23C18/34;C23C18/36;(IPC1-7):C23C18/34 主分类号 C23C18/34
代理机构 代理人
主权项
地址