发明名称 High-frequency module and communication apparatus
摘要 A high-frequency module has a structure wherein transmitting filters, receiving filters and high-frequency power amplifiers are mounted on a multilayered substrate and wherein matching circuits are inserted between input terminals of the receiving filters and output terminals of the transmitting filters. Transmission lines as components of the matching circuits, and the like are formed internally of the multilayered substrate. Thus, the whole body of the high-frequency module can be downsized.
申请公布号 US2005104685(A1) 申请公布日期 2005.05.19
申请号 US20040962170 申请日期 2004.10.07
申请人 KYOCERA CORPORATION 发明人 KUROKI HIROSHI;MORI HIROYUKI;KITAZAWA KENJI;MIYAWAKI YOSHIHIRO
分类号 H01P1/20;H03H9/15;H03H9/72;H04B1/06;H04B1/40;H05K1/00;H05K1/02;H05K1/16;(IPC1-7):H03H9/72 主分类号 H01P1/20
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