发明名称 |
Imaging element, imaging device, camera module and camera system |
摘要 |
The method for manufacturing a camera module of the present invention includes forming a bump on each electrode portion of an imaging element. Next, a through hole is formed in a substrate. The imaging element is then mounted on a first side of the substrate having at least one bump such that a light receiving portion of the imaging element receives light via the through-hole of the substrate. A periphery of the imaging element is sealed to the substrate. Next, a lens unit is mounted on a second side of the substrate.
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申请公布号 |
US2005104991(A1) |
申请公布日期 |
2005.05.19 |
申请号 |
US20040001029 |
申请日期 |
2004.12.02 |
申请人 |
SONY CORPORATION |
发明人 |
HOSHINO KAZUHIRO;SUMI HIROFUMI;YONEMOTO KAZUYA |
分类号 |
H04N5/225;(IPC1-7):H04N5/225 |
主分类号 |
H04N5/225 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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