Method for removal of solder oxide residues from component of solder bath used in electronics manufacture by application of cleaning medium before immersion of component in solder bath

摘要

The method has a cleaning medium applied to the surface of a solder bath component on which solder oxide residues are deposited, before immersion of the component in a solder bath filled with a liquid solder. The cleaning medium is provided by a quantity of an acid reacting powder and a gel which decomposes at temperatures above 100 degrees C for provision of a gas. The gel can be provided by water and organic macromolecules, e.g. cellulose macromolecules. An independent claim for a cleaning medium for removing solder oxide residues from a solder bath component is also included.