LASER PROCESSING DEVICE, PROCESSING METHOD, AND METHOD OF PRODUCING CIRCUIT SUBSTRATE USING THE METHOD

摘要

A laser processing method for performing processing such as perforation etc. on a ceramic green sheet etc. by more effectively using laser light. Light path systems (30, 40) are provided between a laser oscillator (1) in the laser processing device and a radiation position-controlling optical system for radiating laser light to a predetermined position on a piece of work to be processed. A first light path system (30) and a second light path system (40) are arranged, and they are used appropriately depending on the condition of processing. The first light path system (30) guides laser light emitted from the laser oscillator to the radiation position-controlling optical system without changing a cross-sectional shape of the laser light in the direction perpendicular to the axis of the laser light. The second light path system (40) guides the laser light with varied cross-sectional shapes.