MANUFACTURING METHOD OF SUPER THIN FLIP CHIP PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a super thin flip chip package.

SOLUTION: A lower barrier metal film is formed on the metal pad of a semiconductor chip, and the solder bump of a three-dimensional structure which is composed of bars and balls on upper parts of the bars is formed on the lower barrier metal film. The semiconductor chip comprising the solder bump of the three-dimensional structure is reversed and is joined to a solder layer on a printed circuit board, and the flip chip package is completed. Consequently, the solder bump of the three-dimensional structure is adopted and the height of the solder bump can be made low. The flip chip package in which the body is of a super thin type and structural reliability is improved can be obtained.

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