| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method and manufacturing equipment of a semiconductor device which is higher in reliability. <P>SOLUTION: A semiconductor module 100 is prepared which includes a wiring board 10, a plurality of semiconductor chips 20 mounted on a first face 16 of the wiring board 10, a central region 102 overlapped with the semiconductor chips 20, and an end region 104 surrounding the central region 102. The first face 16 of the wiring board 10 is arranged to be confronted with an adhesive tape 40, and the adhesive tape 40 is bonded to the semiconductor module 100 by a roller 50, after which the semiconductor module 100 is cut off from a side of a second face 18 of the wiring board 10. The roller 50 includes a central portion 52 and both ends 54, then the adhesive tape 40 is pressed from an upper part of the central region 102 by the central portion 52. In addition, the adhesive tape 40 is pressed from an upper part of the end region 104 by the both ends 54. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
