| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for supplying resistors/capacitors optimized for producing a semiconductor package incorporating a plurality of semiconductor package substrates and resistors/capacitors. <P>SOLUTION: In an assembly of resistors/capacitors formed on a ceramic substrate or silicon substrate having a controlled thickness, a surface on which the resistors/capacitors are not formed is ground as needed, so that thickness is reduced; and the assembly is adhered on a dicing tape and formed into individual pieces and then supplied; thereby supplying resistors/capacitors that do not so much limit design and production of semiconductor package. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
