| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To stably apply an adhesive with little variation in the amount of application and apply in such a manner that a distance between adjacent chip components can be shortened, when applying the adhesive for bonding fine chip components on a printed circuit board as a fine pattern in order to mount fine chip components each having a size of 1005 or smaller on the printed circuit board which is soldered in a batch process in a flow solder bath. <P>SOLUTION: By devising the shape of the tip of an application nozzle, the expansion of the adhesive applied on the printed circuit board is regulated. For example, a groove is formed in the tip of the application nozzle for applying the adhesive to the printed circuit board. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
