| 摘要 |
The present invention relates to a heat spreader and a semiconductor device package having the same. The semiconductor device package comprises a substrate, a semiconductor die, a heat spreader, a molding compound and a plurality of solder balls. The die is mounted on the top surface of the substrate. The heat spreader comprises a heat spreader body and a supporting portion, wherein the heat spreader body a concavity that is lowered from an outermost edge to the central portion, and the supporting portion extends outwardly and downwardly from the outermost edge to form a cavity to accommodate the semiconductor die. The molding compound encapsulates the substrate, the semiconductor die and the heat spreader, but a top surface of the heat spreader body is exposed to the air. As a result, the concavity can increase heat dissipation area, provide a cushion effect and avoid the molding compound overflow during encapsulation. |
