| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a glass ceramic composition which is suitable for manufacturing a high-strength electronic circuit board. <P>SOLUTION: The glass ceramic composition comprises, by mass%, 30-49% glass powder and 51-70% alumina powder. The glass powder comprises, by mol%, 15-50% SiO<SB>2</SB>, 10-40% B<SB>2</SB>O<SB>3</SB>, 1-15% Al<SB>2</SB>O<SB>3</SB>, 1-20% MgO+CaO, 1-30% SrO+BaO, 1-30% ZnO and 0-10% TiO<SB>2</SB>+ZrO<SB>2</SB>+SnO<SB>2</SB>, provided that B<SB>2</SB>O<SB>3</SB>+ZnO is 15-55%, and contains 0% or <1% alkali metal oxide in total. The alumina powder has a mass average particle size of 0.1-10 μm. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
