| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a package for a piezo-electric device responding to size, thickness and cost reduction, and intensity improvement. <P>SOLUTION: The package comprises a metal base 12 with a cavity 12 a for containing a piezoelectric vibration piece 20, terminal members 14 piercing through terminal holes 22 on the bottom plate 12c of the metal base 12 and connected to the piezoelectric vibration piece 20 at the top end, peripheral walls 12b projectingly provided on the bottom plate 12c of the metal base 12, and an insulating member 16 welded at least to the peripheral wall 12b and the bottom plate 12c and insulating the metal base 12 from the terminal members 14. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
