发明名称 LAMINATION CERAMIC ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a lamination ceramic electronic component of high reliability which is excellent in adhesiveness of an internal electrode and a ceramic layer and is hard to cause delamination and crack, and to provide manufacturing method of the component. SOLUTION: Granulation particle in which ceramic powder is granulated in thickness 0.5-3.0 times the particle size of an internal electrode (internal electrode after calcination). The ceramic powder has average particle size equivalent to or lower than ceramic powder forming a ceramic layer. A ceramic green sheet in which an internal electrode pattern containing the granulation particle at a rate of 2-20 wt.% of total solid part is laminated and stacked by pressure, thereby forming a lamination which is calcinated after the formation. By printing conductive paster which contains the granulation particle of the ceramic powder at a rate of 2-20 wt.% of the total solid on a ceramic green sheet, the internal electrode pattern is formed. By using conductive paste to which the granulation particle is added, the internal electrode pattern is formed. The granulation particle is made to adhere to the surface of the internal electrode pattern. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005129591(A) 申请公布日期 2005.05.19
申请号 JP20030361067 申请日期 2003.10.21
申请人 MURATA MFG CO LTD 发明人 TAIRA HIROAKI;KAWASAKI KENICHI
分类号 H01G4/12;H01G4/30;(IPC1-7):H01G4/30 主分类号 H01G4/12
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