| 摘要 |
PROBLEM TO BE SOLVED: To achieve high precision, improvement in strength, insurance of hermeticity and reliability, reduction of manufacturing cost, and miniaturization/thinning in a metal package of an electronic component. SOLUTION: In manufacturing of the metal package 1 comprising a metal base 3 and a lid 4 joined to the metal base, photoresist films 11 are formed on both of the surface and the back of a metal plate 10, the pattern of an insulating part 6 which surrounds a desired electrode terminal 5 is imprinted on the photoresist film on each surface of the metal plate, wet etching of the metal plate is performed up to a predetermined depth from both sides by using the patterns as masks, and a trench 14 corresponding to the insulating part is formed on the metal plate. The trench is filled with glass material having mobility, calcination is performed, and the insulating part is formed around the electrode terminal and electrically isolates it from the surrounding metal plate. A crystal oscillating piece 2 is mounted on a metal base formed by the above method, the lid is bonded, and sealing is performed airtightly. COPYRIGHT: (C)2005,JPO&NCIPI
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