发明名称 MOISTUREPROOF INSULATING COATING MATERIAL, ELECTRONIC PART SUBJECTED TO INSULATION TREATMENT AND METHOD FOR PRODUCING THE SAME
摘要 PROBLEM TO BE SOLVED: To obtain a heat-resistant moistureproof insulating coating material suitable for moistureproof insulation, or the like, and having excellent adhesion to a substrate, and to provide an electronic part subjected to insulation treatment and a method for producing the same. SOLUTION: The moistureproof insulating coating material comprises (a) 10-40 pts. wt. of a thermoplastic resin, (b) 1-20 pts. wt. of a pressure-sensitive adhesion imparting resin, (c) 0.1-5 pts. wt. of a silane coupling agent and (d) 50-90 pts. wt. of a solvent. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005126456(A) 申请公布日期 2005.05.19
申请号 JP20030360186 申请日期 2003.10.21
申请人 HITACHI CHEM CO LTD 发明人 SUZUKI MASAHIRO;SHIGA SATOSHI
分类号 B05D5/00;B05D7/00;B05D7/24;C09D5/25;C09D7/12;C09D153/02;C09D157/02;C09D193/04;C09D201/00;(IPC1-7):C09D201/00 主分类号 B05D5/00
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