发明名称 THIN PLATE LAYERED STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a layered structure of thin planar members capable of reducing warp by releasing adhesive and bubbles efficiently while ensuring rigidity of the thin planar members. SOLUTION: A release groove 104 for releasing excessive adhesive on the bonding surface 102 of a thin planar member 100 is formed in the bonding surface 102. One end of the release groove 104A in the short side direction is formed to reach the edge part 106 of the thin planar member 100 and to communicate with the atmosphere. Consequently, excessive adhesive and residual bubbles can be released efficiently. Since the other end of the release groove 104A in the short side direction is formed not to reach the edge part 108 of the thin planar member 100, rigidity of the thin planar member 100 is ensured. A release groove may be formed similarly in the back of the bonding surface 102. When the depth of the release groove 104 is set deeper than the width thereof, bonding strength can be ensured and excessive adhesive and residual bubbles can be released efficiently. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005125768(A) 申请公布日期 2005.05.19
申请号 JP20040285112 申请日期 2004.09.29
申请人 FUJI PHOTO FILM CO LTD 发明人 YOKOUCHI TSUTOMU;KOJIMA TOSHIYA
分类号 B41J2/16;B41J2/045;B41J2/055;(IPC1-7):B41J2/16 主分类号 B41J2/16
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