发明名称 Electronic device
摘要 An electronic device having a cavity, which is included in a package, can be sealed with a lid surely and efficiently. A SAW device comprises a SAW chip that is fixed to a plane portion of a stem. A rear surface of the package is hermetically sealed with glass. An opening of a cavity provided on an upper surface of the package is hermetically sealed by a lid with seam welding. Glass is filled to reach the backside of flange of the stem. Such glass prevents the flange from being distorted by the weight of roller electrodes, and keeps the lid and the flange in contact with each other. In addition, the glass serves as a support, and prevents the current from leaking. Therefore, the lid and the flange are sufficiently and surely welded together.
申请公布号 US2005104192(A1) 申请公布日期 2005.05.19
申请号 US20040967338 申请日期 2004.10.19
申请人 MASUKO SHINGO;ICHIKAWA SATOSHI 发明人 MASUKO SHINGO;ICHIKAWA SATOSHI
分类号 H01L23/02;H01L21/50;H03H9/10;H03H9/25;(IPC1-7):H01L23/12 主分类号 H01L23/02
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