Process for manufacturing a wiring substrate

摘要

A process for manufacturing a wiring substrate, comprising: a step of forming thin copper film layers on surfaces of insulating resin layers by plating the same electrolessly with copper; a step of forming plated resists of a pattern over the thin copper film layers; a step of forming wiring pattern layers in clearances of the plated resists by plating the same electrolytically with copper; a step of removing the plated resists and the thin copper film layers just below the plated resists; a step of etching surfaces of the wiring pattern layers to remove a thickness of 1 mum or less from the wiring pattern layers; and a step of forming another insulating resin layers over the insulating resin layers and the wiring pattern layers etched.