| 发明名称 |
SLURRY AND USE THEREOF FOR POLISHING |
| 摘要 |
A slurry containing abrasive particles, an oxidizing agent having a low static etch rate on at least one acid or salt metal, and having a pH of about 5 to about 11 is especially useful for polishing surfaces, including both metal and silicon dioxide, such as present in microelectronics, at the same or substantially the same polishing rates.
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| 申请公布号 |
US2005103743(A1) |
申请公布日期 |
2005.05.19 |
| 申请号 |
US20040904262 |
申请日期 |
2004.11.01 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CHAMBERLAIN TIMOTHY S.;MACDONALD MICHAEL J.;MURRAY MARK |
| 分类号 |
C09G1/02;C09K3/14;H01L21/3105;H01L21/321;(IPC1-7):C23F1/00;H01L21/302;H01L21/461 |
主分类号 |
C09G1/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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