发明名称 LASER BEAM MACHINING DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining device in where the reflected light of laser light irradiated on the surface of a work is detected at high sensitivity, and the machining condition of the work can be securely observed. <P>SOLUTION: In the laser beam machining device 1, an incidence lens 23 is arranged on the side of the incidence end 10a in optical fiber 10 for machining, condenses laser light L<SB>1</SB>emitted from a laser oscillator 15 and allows the same to be made incident on the core 11 of the optical fiber 10 for machining. A machining optical system 20 composed of machining lenses 21 and 22 is arranged on the side of the emission end 10b of the optical fiber 10 for machining, condenses the laser light L<SB>1</SB>transmitted via the core 11 of the optical fiber 10 for machining, and irradiates the same to the surface of a work 30. A part of the laser light reflected on the surface of the work 30 (laser light L<SB>2</SB>deviated from the light path of the laser light L<SB>1</SB>as incident light) is made incident on a clad layer 12 of the optical fiber 10 for machining. Further, a sensor apparatus 41 is arranged on the side of the incidence end 10a of the optical fiber 10 for machining, and detects laser light L<SB>3</SB>reflected by the work 30 and returned to the side of the laser oscillator 15 via the clad layer 12 of the optical fiber 10 for machining. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005125398(A) 申请公布日期 2005.05.19
申请号 JP20030366075 申请日期 2003.10.27
申请人 SHIBAURA MECHATRONICS CORP 发明人 KOYAMA HIROTAKA
分类号 B23K26/02;B23K26/03;B23K26/08;(IPC1-7):B23K26/02 主分类号 B23K26/02
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