| 摘要 |
PROBLEM TO BE SOLVED: To provide substrate treatment equipment and a substrate treatment method by which a treatment time is shortened and the crack of a substrate and the defective transfer of the substrate are not caused. SOLUTION: The substrate treatment equipment 1 includes a table 3 on which the substrate 2 is placed, a pin 4 which moves the substrate 2 in a direction away from the table 3, and a control device of a position of the pin 4 that moves the pin 4 to a transfer position P2 after stopping the pin at an intermediate position P1. The control device of the position of the pin comprises respective elements of air cylinders 6, 16, solenoid valves 13, 23, a supply air source 14, and a control circuit 17. Instead of stopping the pin 4 at the intermediate position P1, the control device may also control so that the pin 4 is slowly raised up to the intermediate position P1, then it is raised at a high speed from the intermediate position P1 to the transfer position P2. The substrate 2 is thoroughly removed from the table 3 while the pin stops at the intermediate position P1 or while it is slowly raised up to the intermediate position P1, and the crack, deformation or the like of the substrate 2 are not caused. COPYRIGHT: (C)2005,JPO&NCIPI |
