| 摘要 |
PROBLEM TO BE SOLVED: To provide a device and a method for treating an electronic component by which the terminal of an electronic part is plated with a lead-free solder and the electronic component is adapted to a lead-free solder mounting step. SOLUTION: A coil 1 is comprised of a coil bobbin 2, a coil wire 3, and a part 4 that is made as a terminal through a following step. The coil wire 3 is a coated wire wherein a wire material made mainly of copper is covered with a resin, which is called an enameled wire in general. A handler 5 handling the coil 1 as an electronic component comprises a movable structure shown by an arrow in a diagram, and it can elevate while it holds the coil 1. A micro plasma source 6 is connected with a gas supply unit 7 and a power source 8, and it can locally generate a plasma and the enamel coating of the part 4 as a terminal can be removed. COPYRIGHT: (C)2005,JPO&NCIPI
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