发明名称 HEAT-RESISTANT PEELABLE ADHESIVE FILM
摘要 PROBLEM TO BE SOLVED: To provide an adhesive film having an adhesive layer which has an initial adhesive force and an adhesive force after heated at a high temperature for a long hour at low levels, can easily be peeled also after exposed on a high temperature condition, does not cause the breeding and migration of a silicone component, and does not leave an adhesive on the peeled surface, to provide an adhesive and a copolymer composition used for the film. SOLUTION: This copolymer composition is obtained by copolymerizing in an organic solvent all copolymerization components comprising a main monomer component comprising an alkyl (meth)acrylate monomer having 3 to 12 carbon atoms in the alkyl portion, a cross-linkable monomer component, and a reactive azo group-containing polysiloxane amide component. The adhesive comprises the copolymer composition, an isocyanate-based curing agent or an isocyanate-based curing agent and an amine-based curing agent, and, if necessary, further an epoxy-based curing agent. The adhesive film is obtained by coating the surface of a film with the adhesive. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005126500(A) 申请公布日期 2005.05.19
申请号 JP20030361467 申请日期 2003.10.22
申请人 PANAC CO LTD 发明人 SUZUKI HIROMASA
分类号 C09J7/02;C08F4/04;C08F220/18;C08F283/12;C09J133/04;C09J151/08;C09J161/26;C09J175/04;C09J183/10;(IPC1-7):C08F220/18 主分类号 C09J7/02
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