| 摘要 |
A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed board, prepreg and adhesive sheet are provided which exhibit improved mechanical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties. A resin composition containing 100 parts by weight of a thermosetting resin and 0.1-65 parts by weight of an inorganic compound, the resin composition having a mean linear expansion coefficient (alpha2) of up to 17x10<SUP>-3 </SUP>[° C.<SUP>-1</SUP>] over the temperature range from a temperature 10° C. higher than a glass transition temperature of the resin composition to a temperature 50° C. higher than the glass transition temperature of the resin composition.
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