| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To enable a circuit board provided to the electronic scope of an endoscope to be improved in reliability. <P>SOLUTION: A through-hole H12 is provided to the end face S1 of a relay board 50 by boring a through-hole in the board 50 penetrating through its front surface 50A and rear surface 50B, and by plating a recess having the same shape with that obtained by cutting off the board 50 along a plane which contains the center axis of the through-hole and is perpendicular to the front and rear surface, 50A and 50B, of the board 50. A land LA12 is formed on the front surface 50A as it is continuously joined to the through-hole H12, and a conductor pattern PA12 is formed as it is continuously connected to the land LA12. A land LB12 is formed on the rear surface 50B of the board 50 as it is continuously joined to the through-hole H12. The lands LA12 and LB12 are formed as spreading over a region wider than a conventional land shown by a dashed line. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
