METHOD OF MOUNTING ELECTRONIC ELEMENT, JOINED SUBSTRATE BODY AND METHOD OF MANUFACTURING THE SAME, WIRING SUBSTRATE, AND ELECTROOPTIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method of mounting an electronic element which can suppress thermal deformation of a substrate in bonding the electronic element to an electric-signal wire. SOLUTION: Heat is conducted to a bonding material 14b via a prescribed wire (heat conducting wire 15) on a wiring substrate 10 in bonding the electric-signal wire 12 and the electronic element 27 by heating the bonding material 14b. COPYRIGHT: (C)2005,JPO&NCIPI