| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a semiconductor chip from becoming easily cracked at the time of forming recesses and projects on the surface of the chip. <P>SOLUTION: The semiconductor chip 10 has a semiconductor substrate 12 containing parallel first and second surfaces 14 and 16 which are directed to opposite directions, and a plurality of side faces 21-24 which connect the peripheral edges of the first and second surfaces 14 and 16 to each other. At least one of the side faces 21-24 is formed in a slope inclined against the first and second surfaces 14 and 16, and a groove 26 is formed on the slope. The groove 26 is extended in a direction intersecting a plane which is parallel to the first and second surfaces 14 and 16 and, at the same time, in a direction intersecting a plane intersecting the surfaces 14 and 16 at right angles. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
