| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing method of a projection for easily and efficiently performing any of planar polishing and side surface polishing of a tip part of the projection such as a through-electrode. <P>SOLUTION: A semiconductor wafer W is formed into a thin plate, and a plurality of connecting electrodes 28 covered with an insulating film are projected from the reverse surface. A plurality of recessed parts 42 are formed in a position corresponding to the connecting electrodes 28 on an upper surface of a tool 40. In polishing, a predetermined quantity of polishing liquid is supplied in the recessed parts 42 formed in the tool 40, and the tool 40 is rocked with a predetermined turning radius in a state of fitting the respective connecting electrodes 28 to the recessed parts 42. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
