| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic part packaging apparatus which can prevent an electronic part from being dropped on a substrate. <P>SOLUTION: The electronic part packaging apparatus for mounting the electronic part at a predetermined position on a circuit substrate includes an electronic part supply means for supplying a plurality of the electronic parts, a head supported on the substrate movably in an X-Y direction, a suction nozzle supported vertically movably to the head and mounted at a predetermined position on the circuit substrate to suck the electronic part supplied from the electronic part supply means, a shutter fixed to the head and disposed to be normally closed and in the vertically moving range of the suction nozzle to open at mounting time on the substrate, and an electronic part discarding part for discarding the electronic part fixed to a frame under the moving range of the head. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
