| 发明名称 |
ETCHING LIQUID AND ETCHING METHOD FOR LOW-K FILM |
| 摘要 |
<p>Disclosed is an etching liquid for low-k films which contains (1) HF and/or a salt thereof and (2) H2SO4. The etching liquid may further contain (3) water, if necessary.</p> |
| 申请公布号 |
WO2005045912(A1) |
申请公布日期 |
2005.05.19 |
| 申请号 |
WO2004JP16518 |
申请日期 |
2004.11.08 |
| 申请人 |
DAIKIN INDUSTRIES, LTD.;KEZUKA, TAKEHIKO |
发明人 |
KEZUKA, TAKEHIKO |
| 分类号 |
H01L21/768;H01L21/304;H01L21/306;H01L21/308;H01L21/311;H01L23/522;(IPC1-7):H01L21/306 |
主分类号 |
H01L21/768 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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