摘要 |
PROBLEM TO BE SOLVED: To provide a conveyance control method of improving throughput by continuously carrying wafers in other treatment chambers even if one treatment chamber of a substrate treatment apparatus gets out of order. SOLUTION: This conveyance control method includes a substrate carrying-in step wherein a 1st robot carries substrates from a cassette port to a load lock chamber and a 2nd robot carries them from the load lock chamber to a treatment chamber, a substrate treatment step wherein the substrates are treated in a plurality of treatment chambers, respectively, a substrate carrying-out step wherein the 2nd robot carries respective substrates from the treatment chambers to the load lock chamber and the 1st robot carries them from the load lock chamber to the cassette port, a staying substrate discharge step wherein if treatment is not completed in a specified time owing to some abnormalities of the plurality of treatment chambers, a substrate staying at the 1st robot, load lock chamber, or a reloading chamber is temporarily returned to the cassette port, and a treatment continuing step wherein substrates to be treated in treatment chambers operating normally are carried and continuously treated. COPYRIGHT: (C)2005,JPO&NCIPI
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