发明名称 |
METHOD FOR MAKING A FLAT-TOP PAD |
摘要 |
A method for preparing flat-top pads in electronic components includes the steps of: a) stencil printing a flat-top deposit of a curable silicone composition onto a first electronic substrate, where the first electronic substrate is selected from a semiconductor die or a semiconductor die attachment member, where stencil printing the flat-top deposit is performed by squeegee through a down-step stencil; b) curing the flat-top deposit to form a flat-top pad; optionally c) adhering a second electronic substrate to the top of the flat-top pad, where the second electronic substrate is selected from a semiconductor die or a semiconductor die attachment member; and optionally d) repeating steps a), b) and c). |
申请公布号 |
WO2005045903(A2) |
申请公布日期 |
2005.05.19 |
申请号 |
WO2004US25044 |
申请日期 |
2004.08.03 |
申请人 |
DOW CORNING CORPORATION;SOLIZ, DEBRA;LEE, YEONG |
发明人 |
SOLIZ, DEBRA;LEE, YEONG |
分类号 |
H01L21/58;H01L21/98;H01L25/065 |
主分类号 |
H01L21/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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