| 摘要 |
PROBLEM TO BE SOLVED: To provide a connection device capable of performing conductive junction between a seat substrate and a circuit board at required junction intensity, and to provide a method for manufacturing the connection device. SOLUTION: Since first and second adhesives 13, 14 are formed by components which are cured by mutually different reaction forms, conductive junction between the seat substrate 10 and the circuit board 20 can be performed at required junction intensity. Consequently, the installation space of both the adhesives 13, 14 can be reduced. COPYRIGHT: (C)2005,JPO&NCIPI
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