| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface-mounting electronic circuit unit which does not include a fault by soldering at the time of surface mounting and ensures higher surface mounting process. SOLUTION: The surface-mounting electronic circuit unit shields with an insulating film 8 between the immediately adjacent solder 7 and land 3 because the insulating film 8 is provided over the lower surface of the solder 7 and the lower surface 1b of the circuit board 1 located near the lower surface of the solder 7. Accordingly, when the circuit board 1 is surface-mounted to a mother board, the solder 7 and the land 3 does not become conductive with the solder 7 at the time of surface mounting, and a fault of solder 7 can be eliminated at the time of surface mounting, resulting in reliable soldering process. COPYRIGHT: (C)2005,JPO&NCIPI
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