发明名称 METHOD FOR FORMING MICRO PATTERN
摘要 PROBLEM TO BE SOLVED: To form a micro pattern that is below a resolution limit of lithography and is superior in dimensional controllability. SOLUTION: The method for forming a micro pattern includes a step wherein a film to be processed and a first film are formed on a semiconductor substrate in sequence, a step wherein a part of the first film is etched in a normal tapering manner where the groove width is made smaller toward the film to be processed until the film is exposed, a step wherein the entire surface of the groove wall is covered with a second film of which etching selection ratio is different from those of the film to be processed and the first film, a step wherein the first film aside the second film is etched almost vertically to the film to be processed while the second film is used as a mask until the film to be processed is exposed, and a mask material is left on the side wall of the second film by using the first film, a step to remove the second film by etching, and a step to etch the film to be processed while the mask material is used as a mask. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005129702(A) 申请公布日期 2005.05.19
申请号 JP20030363277 申请日期 2003.10.23
申请人 TOSHIBA CORP 发明人 OGUMA HIDEKI;NARITA MASAKI
分类号 H01L21/28;H01L21/3065;H01L21/3213;(IPC1-7):H01L21/306;H01L21/321 主分类号 H01L21/28
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