| 摘要 |
PROBLEM TO BE SOLVED: To provide an X-ray analysis apparatus capable of determining the thickness of plating even when the film thickness of the plating formed on the surface of a sample is of 10μm or thicker. SOLUTION: The X-ray analysis apparatus is provided with a primary X-ray source 10 for irradiating primary X-rays 14A, 14B to a sample 1 in which a film 1a is formed in its surface, a detecting means 3 for measuring the intensity of scattering rays 5 of the primary X-rays 14A, 14B scattered at the sample 1, and a computing means 9 for computing the thickness of the film 1a on the basis of the intensity of the scattering rays measured by the detecting means 3. The energy of the scattering rays 5 to be measured by the detecting means 3 is of 30 keV or higher. COPYRIGHT: (C)2005,JPO&NCIPI
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