| 发明名称 |
Rotating sputtering magnetron |
| 摘要 |
The magnet arrangement and resulting rotating sputtering magnetron design of an embodiment provides magnetic flux density and distribution to penetrate thick production ferrous targets. Further, the magnetic field shape improves target life by more uniformly removing target material.
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| 申请公布号 |
US2005103619(A1) |
申请公布日期 |
2005.05.19 |
| 申请号 |
US20040982616 |
申请日期 |
2004.11.03 |
| 申请人 |
STELTER RICHARD;WELK ARON;PADUA CHRISTOPHER;LI CHUN |
发明人 |
STELTER RICHARD;WELK ARON;PADUA CHRISTOPHER;LI CHUN |
| 分类号 |
C23C14/35;H01J;H01J37/34;(IPC1-7):C23C14/35 |
主分类号 |
C23C14/35 |
| 代理机构 |
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