发明名称 |
Conductive bumps with non-conductive juxtaposed sidewalls and method for fabricating |
摘要 |
A microelectronic structure having a substrate of multiple conductive bumps for contact with bond pads on an electronic substrate in the fabrication of a flip chip electronic assembly. Each of the conductive bumps includes a conductive layer which is absent from at least one sidewall of the bump to prevent the inadvertent formation of a short-circuiting electrical path between adjacent conductive bumps in the electronic assembly.
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申请公布号 |
US2005104223(A1) |
申请公布日期 |
2005.05.19 |
申请号 |
US20030714277 |
申请日期 |
2003.11.14 |
申请人 |
HUANG YUAN-CHANG;CHANG SHYH-MING;LU SU-CHIA |
发明人 |
HUANG YUAN-CHANG;CHANG SHYH-MING;LU SU-CHIA |
分类号 |
H01L21/60;H01L23/48;H01L23/485;(IPC1-7):H01L23/48 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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