| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor chip capable of avoiding the occurrence of migration, a manufacturing method thereof, a semiconductor mount substrate with high reliability, an electronic device, and an electronic apparatus provided therewith. <P>SOLUTION: The semiconductor chip includes a substrate 2 on which a wiring pattern is formed; and a plurality of terminals 3 provided on part of the wiring pattern in a way that the terminals 3 are in contact with the part, and a relation of S<SB>2</SB>/ S<SB>1</SB>≥ 1.1 holds, wherein S<SB>1</SB>[μm<SP>2</SP>] is an area at the end of each terminal 3, the side of the end is in contact with the substrate 2, and S<SB>2</SB>[μm<SP>2</SP>] is an area at the end of each terminal 3 opposite to the side in contact with the substrate 2. Each terminal 3 has an area reduction part with the cross-sectional area gradually reduced toward the substrate 2. The semiconductor chip also includes a resin layer 8 mainly made of a thermoplastic resin and formed to bury a gap between the adjacent terminals. The height B of each terminal 3 is selected lower than the thickness A of the resin layer 8. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
