| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit device wherein the spacing between conductive patterns is made uniform, and to provide a manufacturing method thereof. <P>SOLUTION: This manufacturing method of the circuit device comprises the steps of preparing conductive foil 40, forming conductive patterns 11 constituting units 45 each having a mounting region for at least a circuit component 12 by forming equally spaced isolation grooves 41 having a width in the conductive foil, electrically connecting the conductive pattern 11 with the circuit component 12, sealing with a sealing resin so that the circuit components 12 are covered and the isolation grooves 41 are filled with the sealing resin, and removing the conductive foil in the thickness portion thereof wherein the isolation grooves 41 are not present. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
