| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable electronic parts to be mounted on both the surfaces of a board without making a manufacturing process complicated. <P>SOLUTION: After wiring layers 2a to 2d are formed on the one surface of a flexible board 1, through-holes 3a and 3b are bored in the board 1 penetrating through the wiring layers 2a and 2d, electronic parts 4a to 4c are mounted on the flexible board 1, the flexible board 1 is folded up so as to enable the through-holes 3a and 3b to overlap with each other, and the through-holes 3a and 3b are filled up with a conductor 6. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
