| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting method of a semiconductor device exhibiting high reliability without requiring a step for transferring conductive paste to a bump electrode. SOLUTION: An insulating layer 3 is formed on a substrate 2 on which a wiring pattern 4 is formed, a bottomed via hole reaching the wiring pattern 4 is formed in the insulating layer 3 in the thickness direction, and then the bottomed via hole is filled with a conductive material 6, i.e. conductive paste containing conductive particles or conductive particles and thermoplastic resin. A via electrode filled with the conductive material 6 is then connected with the electrode (bump electrode 10) of a semiconductor device 8. COPYRIGHT: (C)2005,JPO&NCIPI
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