| 摘要 |
PROBLEM TO BE SOLVED: To provide a piezoelectric device capable of reducing its size even when chip parts for matching circuits or the like are loaded on the piezoelectric device and having high electric characteristics. SOLUTION: In an MCF 19, a piezoelectric substrate 2 is adhesively fixed by applying conductive adhesives 7 to prescribed pads 21 formed on the inner bottom of a ceramic package 20, two prescribed recessed parts 23a, 23b are formed on the outer bottom of the ceramic package 20, chip parts L11, C12 constituting an input side matching circuit for an MCF element 10 are loaded on a pad 24 formed in the recessed part 23a, and chip parts L13, C14 constituting an output side matching circuit for the MCF element 10 are loaded on a pad 24 formed in the recessed part 23b. Then side metalized parts 25a, 25b are respectively formed on the whole side walls of the two recessed parts 23a, 23b and a solid earth pattern 26 of a prescribed shape is formed on the outer bottom of the MCF 19 to connect both the recessed parts 23a, 23b. COPYRIGHT: (C)2005,JPO&NCIPI
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