发明名称 Method of manufacturing flash memory device
摘要 Disclosed is a method of manufacturing a flash memory device. In a flash memory device using a SA-STI scheme, a trench for isolation is buried with oxide. A field oxide film is then formed by means of a polishing process. Next, field oxide films of a cell region and a low-voltage transistor region are selectively etched by a given thickness. As EFH values of the cell region, the low-voltage transistor region and the high-voltage transistor region become same or similar, it is possible to secure stability of a subsequent process.
申请公布号 US2005106822(A1) 申请公布日期 2005.05.19
申请号 US20030745008 申请日期 2003.12.23
申请人 LEE SEUNG C.;PARK SANG W. 发明人 LEE SEUNG C.;PARK SANG W.
分类号 H01L21/76;H01L21/336;H01L21/8234;H01L21/8247;H01L27/08;H01L27/088;H01L27/10;H01L27/105;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L21/336 主分类号 H01L21/76
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