发明名称 |
Method of manufacturing flash memory device |
摘要 |
Disclosed is a method of manufacturing a flash memory device. In a flash memory device using a SA-STI scheme, a trench for isolation is buried with oxide. A field oxide film is then formed by means of a polishing process. Next, field oxide films of a cell region and a low-voltage transistor region are selectively etched by a given thickness. As EFH values of the cell region, the low-voltage transistor region and the high-voltage transistor region become same or similar, it is possible to secure stability of a subsequent process.
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申请公布号 |
US2005106822(A1) |
申请公布日期 |
2005.05.19 |
申请号 |
US20030745008 |
申请日期 |
2003.12.23 |
申请人 |
LEE SEUNG C.;PARK SANG W. |
发明人 |
LEE SEUNG C.;PARK SANG W. |
分类号 |
H01L21/76;H01L21/336;H01L21/8234;H01L21/8247;H01L27/08;H01L27/088;H01L27/10;H01L27/105;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L21/336 |
主分类号 |
H01L21/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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