| 摘要 |
An inductor for an integrated circuit made of a plurality of stacked, electrically coupled, metal layers. Each metal layer includes an inductor formed of a spiral pattern, which except for the top and bottom inductors, are electrically coupled to the spiral inductor formed on the metal layer above and below with an electrical path or via formed between each metal layer. The top and bottom inductors are electrically coupled to the inductor directly below and above, respectively.
|
