发明名称 Cutting tip for diamond tool and diamond tool
摘要 The present invention relates to a cutting tip for a diamond tool and a diamond tool having the same which serve to cut or perforate various brittle materials such as stone, brick, concrete and asphalt. In particular, the cutting tip for a diamond tool and the diamond tool have diamond particles which are suitably arrayed to improve the cutting rate. The present invention provides a cutting tip for a diamond tool having diamond particles which are distributed in the cutting tip, wherein the diamond particles are inclined in respect to a cutting direction in a plane parallel to a cutting surface, and arrayed whereby grooved channels are formed successively overlapped on a brittle substance in cutting operation.
申请公布号 US2005103534(A1) 申请公布日期 2005.05.19
申请号 US20040503799 申请日期 2004.08.06
申请人 KIM SOO-KWANG;KIM JONG-HO;PARK HEE-DONG 发明人 KIM SOO-KWANG;KIM JONG-HO;PARK HEE-DONG
分类号 B24D3/00;B23D61/18;B24D3/06;B24D5/06;B24D5/12;B28D1/04;B28D1/12;(IPC1-7):E21B10/36 主分类号 B24D3/00
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