发明名称 |
Cutting tip for diamond tool and diamond tool |
摘要 |
The present invention relates to a cutting tip for a diamond tool and a diamond tool having the same which serve to cut or perforate various brittle materials such as stone, brick, concrete and asphalt. In particular, the cutting tip for a diamond tool and the diamond tool have diamond particles which are suitably arrayed to improve the cutting rate. The present invention provides a cutting tip for a diamond tool having diamond particles which are distributed in the cutting tip, wherein the diamond particles are inclined in respect to a cutting direction in a plane parallel to a cutting surface, and arrayed whereby grooved channels are formed successively overlapped on a brittle substance in cutting operation.
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申请公布号 |
US2005103534(A1) |
申请公布日期 |
2005.05.19 |
申请号 |
US20040503799 |
申请日期 |
2004.08.06 |
申请人 |
KIM SOO-KWANG;KIM JONG-HO;PARK HEE-DONG |
发明人 |
KIM SOO-KWANG;KIM JONG-HO;PARK HEE-DONG |
分类号 |
B24D3/00;B23D61/18;B24D3/06;B24D5/06;B24D5/12;B28D1/04;B28D1/12;(IPC1-7):E21B10/36 |
主分类号 |
B24D3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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