发明名称 |
Chip-on-film package for image sensor and method for manufacturing the same |
摘要 |
A chip-on-film (COF) package and method for image sensor has been disclosed. According to the method a COF film with opening is provided. The COF film has an upper surface, a lower surface and at least an opening. An image sensing chip is flip-chip mounted on the upper surface of the COF film. A transparent glass is bonded to the lower surface of the COF film. The opening is clipped by the transparent glass and the image sensing chip to form a hermetic space. The active surface of the image sensing chip includes an image sensing region toward the transparent glass through the opening and is sealed in the hermetic space by a limited filling material in order to prevent the image sensing region of the image sensing chip from contamination by means of COF tape packaging method. |
申请公布号 |
US2005104186(A1) |
申请公布日期 |
2005.05.19 |
申请号 |
US20030706997 |
申请日期 |
2003.11.14 |
申请人 |
INTERNATIONAL SEMICONDUCTOR TECHNOLOGY LTD. |
发明人 |
YANG CHARLES;KUO ALLEN |
分类号 |
H01L21/56;H01L31/0203;(IPC1-7):H01L29/22;H01L23/48;H01L31/00 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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