A method for treating a film by providing a structure including a substrate and an array of upstanding projections each of which includes multiple contact points. The structure is pressed against the surface of a polymeric film to cause deformation or rupture of the film. The film may then be pressed to partially reseal the perforations. The structure can be produced by electroplating a mould which includes an array of elements of dimensions corresponding to the projections of the desired structure.
申请公布号
EP1345753(A4)
申请公布日期
2005.05.18
申请号
EP20010983329
申请日期
2001.11.20
申请人
AMCOR PACKAGING (AUSTRALIA) PTY, LTD
发明人
HARVEY, EROL, CRAIG;WAYCOTT, RAMON, GLENNY;CAREW, DAVID LEE