Scheibentransfervorrichtung

摘要

A Wafer transfer apparatus (10) for attaching a wafer (W), which is divided into a plurality of chips and which has a protective tape (P) adhered to its surface, to a ring frame (R) by means of a transfer tape (T), comprising: a positioning unit (400) arranged to dispose the wafer with the protective tape adhered thereto on a positioning table (401), and arranged to perform a positional adjustment of the wafer in longitudinal (X), lateral (Y) and rotational (θ) directions, so that the wafer is located in a reference position; a transfer tape mount unit (600) arranged to dispose the wafer with the protective tape adhered thereto, which has been located in the reference position by the positioning unit, on a transfer tape mount table (602), and arranged to adhere a transfer tape both to a ring frame disposed round the periphery of the wafer and to the back of the wafer, so that the wafer and the ring frame are adhered to each other and integrated; and a protective tape peeling unit (800) arranged to dispose the wafer, which has the transfer tape adhered thereto and which has been integrated with the ring frame by the transfer tape mount unit, on a protective tape peeling table (802), arranged to bond an end of a peeling tape to an end of the protective tape adhered to the wafer surface, and arranged to pull the peeling tape so that the protective tape is peeled from the wafer surface. This apparatus enables preventing cracking caused by the carrying of a thin wafer, breakage and cracking caused by the carrying conducted between devices by means of carriers, etc., and wafer cracking caused by takeout from the inside of carriers.