| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition useful for mounting a photosemiconductor, in particular applied for a blue and a white photosemiconductor, as it has particularly excellent translucency and resistance to UV light, does not discolor even after heated for a long period of time, and has low moisture absorption. SOLUTION: This epoxy resin composition comprises (A) an epoxy resin component containing an epoxy resin having a structure represented by general formula (1), (B) a curing agent and (C) a curing accelerator. COPYRIGHT: (C)2005,JPO&NCIPI
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